As a Senior Package Engineer at NVIDIA, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages. Your responsibilities will include planning schedules, resolving costs, packaging, manufacturing, and electrical design issues.
Key tasks include:
Leading the development of groundbreaking microelectronics packaging for Nvidia Networking Business Unit's future products Collaborating with world-leading vendors to develop highly ambitious packaging solutions Joining and leading task forces to investigate and support production excursions, failure analysis, and reliability issues Failure investigations and production support for High volume products
To succeed in this role, you will need:
MSc or equivalent experience in Mechanical Engineering / Materials Engineering or similar At least 5 years of experience with development of complex processes (warpage, heat, optics, Adhesives, etc) Experience co-working with subcontractors and vendors Vision and focus for projects and team Curious and creative problem solver as well as organized and multi-tasker Team oriented, able to move and motivate peers. Strong interpersonal skills (verbal and written) High awareness of quality, manufacturability and project schedule
If you have a proven record in packaging development and background in semiconductor manufacturing processes and optical systems, you will stand out in this role.
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