We are seeking a Senior Manager to lead the Silicon Failure Analysis (SiFA) Lab Infrastructure, responsible for enabling a high-availability, safe, and scalable failure analysis environment. This role leads the lab framework including facilities, utilities, tool enablement, safety, access control, and operational readiness so that Fault Isolation (FI), Physical Failure Analysis (PFA), and Supplier Quality Engineering (SQE) teams can efficiently root cause our groundbreaking semiconductor products.
The Senior Manager will own day-to-day lab operations and infrastructure readiness, serving as the primary point of accountability for availability, reliability, and rapid resolution of infrastructure issues impacting failure analysis operations. They will manage lab facilities and utilities including power, backup power, cooling water, DI/PCW, exhaust, vacuum, CDA, nitrogen, and specialty gases, coordinating upgrades, maintenance, outages, and construction to minimize disruption.
The Senior Manager will drive failure analysis tool enablement and reliability from delivery through sustained operation, ensuring preventive maintenance and improving uptime, availability, MTBF, MTTR, and PM compliance. They will lead vendor and cross-functional partnerships with FI, PFA, SQE, Corporate Facilities, EHS, IT, Finance, Procurement, and equipment suppliers to reduce downtime and ensure operational resilience.
The Senior Manager will own consumables, inventory, and asset management including gases, chemicals, PPE, and materials, with accurate tracking of inventory, asset lifecycle status, and preventative maintenance schedules. They will ensure safety, chemical, ESD and regulatory governance by partnering with Corporate EHS, maintaining lab operating specifications, auditing access controls, and enforcing training, certification, safety, and IP protection requirements.
The Senior Manager will define and execute the long-term SiFA lab infrastructure roadmap, leading multi-year planning and phased expansion to support future silicon nodes, advanced packaging technologies, and increasing system complexity.
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