Advanced Packaging Technologist
About the Team:
OpenAI's Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI's supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI.
Role Overview
We are seeking an experienced engineer to lead the development of advanced packaging technologies that enable next-generation, high-performance compute systems. This role sits at the intersection of chip architecture, package integration, and manufacturing scale-up, driving breakthroughs in performance, power, thermal, and reliability. The ideal candidate brings deep expertise in 2.5D and 3.5D large-reticle integration and Co-Packaged Optics (CPO) packaging, with a proven ability to translate advanced concepts into qualified, high-volume production solutions.
In this role you will:
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Architect, develop, and prototype advanced packaging solutions (2.5D/3D integration, large-format interposers/bridges, high-density substrates, advanced assembly flows), and drive end-to-end qualification for high-volume production.
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Develop packaging concepts and requirements to support CPO packaging, including optical/electrical co-integration considerations, thermal/mechanical constraints, and high-volume manufacturability.
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Lead large-reticle and multi-die integration strategies, including mechanical/thermal co-design, warpage control, and yield/reliability risk mitigation across package scale-up.
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Identify and solve fundamental technical challenges in package architecture, integration, and manufacturability for high-performance compute chips.
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Collaborate closely with cross-functional teams (silicon architecture, SI/PI, thermal, mechanical, system, test, and manufacturing) to align package development with product requirements and program milestones.
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Drive vendor engagement and technical alignment with external partners (foundry/OSAT/material/tool vendors), including technology selection, DOE planning, and qualification readiness.
You might thrive in this role if you have:
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Large-reticle / large-body-size integration, including interposer/bridge-based architectures, package-scale mechanical/thermal risk management, and manufacturability at scale.
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Hands-on experience with CPO packaging, including package-level optical integration constraints and cross-domain trade-offs (electrical/optical/thermal/mechanical).
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Proven track record developing and productizing large-format, high-power, high-speed advanced packaging technologies for high-performance compute products.
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In-depth expertise across advanced packaging techniques and platforms used in the semiconductor industry (2.5D, 3D stacking, interposers/bridges, high-density substrates, advanced materials and assembly).
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Strong understanding of chip–package co-design: how chip architecture, I/O, power delivery, and floorplan decisions interact with packaging architecture and constraints.
Preferred Qualifications
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Solid understanding of thermal and mechanical interactions in large-format packages (warpage, stress, lid/heat-spreader/cold-plate interfaces, material interactions).
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Working knowledge of reliability requirements and qualification methodologies for advanced packages (JEDEC/industry practices, failure analysis, DOE-driven learning cycles).
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Familiarity with system-level considerations and chip architecture fundamentals (I/O topology, HBM/advanced memory integration, SI/PI constraints, module-to-system integration).
